Sensor Manufacturing and Process Control Week 4

---Which one of these semiconductor processes is unique to MEMS construction? 

Bulk Micromachining

---Which one of these semiconductor tools, processes or chemicals are used in Photolithography?

Resist

Spin coating

---Which one of these semiconductor tools, processes or chemicals are used in Surface Micromachining?

Sacrificial material layer

Etching chemical

Photoresist

 ---Which one of these methods of wire bonding cannot possibly be done using aluminum wire?

Thermosonic

 ---Why is aluminum wire used for wire bonding of power electronic circuits? 

Gold wire is too expensive

 ---Which process can be used to perform both ball bonding and wedge bonding?

Thermosonic

---What design requirements for a pressure sensor housing would lead you to construct it out of plastic material?

The maximum pressure rating is one bar or below

It needs to be very low cost

 

---What is the purpose of the faceted mirror in the IR motion detector?

It prevents visible light from hitting the pyroelectric sensor

---Which of the following statements about extreme testing are true?

You perform extreme testing to uncover design flaws 

Mechanical shock testing induces failures to wire bonds, adhesive joints, and solder joints

 

---What is the difference between HALT and HASS?

HALT is used for prototype testing, while HASS is used for manufacturing testing

With HALT you find the upper and lower destructive limits of environmental testing, while with HASS you use limits that are just outside the normal operating range.